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The OAI Model
2000 may be configured as either an edge-bead exposure tool or a flood
exposure system; both configurations are based on a proven, time-tested
platform.
The OAI 2000SM Edge-bead Exposure System provides a cost-effective
method for edge-bead removal using standard shadow mask technology.
Mask and substrate changeover can be accomplished quickly and easily
adding to the versatility as well as throughput of this high volume
production tool.
The Model 2000 systems include a UV lightsource, intensity controlling
power supply and robotic substrate handling subsystem. UV lightsources
provide adjustable intensity beams with divergence half-angles of
<2.0%. Power supplies are available from 200W to 2,000W. Intensity
controller sensors are linked directly to the lightsource for accurate
intensity monitoring. The OAI robotic substrate handling system is
microprocessor controlled and may be programmed to accommodate a wide
variety of substrate sizes. The shadow mask capability enables the
user to pattern the top-side of a substrate while being held in very
close proximity to the mask. At a separation of 25 microns, these
systems are capable of 6 micron resolution.
2000FL Flood Exposure Systems are used to augment and/or enhance the
photolithography processes in both production and R&D settings. Applications
include photoresist stabilization and modification, image reversal
and PCM processes.
Click here for 2000 FL features and specifications
Click
here for 2000 SM features and specifications
Click
here to return to product selection page
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