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| FEATURES
AND SPECIFICATIONS • System throughput is independent of exposure pattern complexity. • Entire wafer is exposed at one time. • Changing the exposure pattern is as simple as changing the mask. • Changeover (including mask alignment) takes only ten minutes. • After initial alignment, system processes remaining wafers automatically. • The system has only one moving component. • Uniform, Repeatable exposures. • Intensity controlling power supply drives the UV exposure system. • System is easy to operate and requires very little maintenance. Click here to return to 2000 SM main page Click here to return to product selection page |