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Designed for maximum versatility, the OAI Model 500
high-resolution mask alignment and exposure system is a high-performance
contact mask aligner developed for ultra-precise, submicron, level-to-level
alignment lithography. The Model 500 features a family of interchangeable
modular subsystems including a choice of exposure systems with intensity
controlling power supplies, mask alignment tooling systems, and alignment
optics. The Model 500 is a cost-effective design that enables the
user to adapt quickly and easily to changing requirements. Ideal for
both standard as well as unique applications, the Model 500 can be
configured for a wide range of applications including infrared-based,
substrate-to-mask alignment. Exposure systems facilitates quick change
between the Near, Mid and Deep UV spectrums. The system can process
a wide range of materials including glass and ceramic ranging in substrate
size from 5mm to 200mm. The Model 500 alignment tooling incorporates interchangeable mask/substrate chuck capability, differential micrometer or motorized electronic motions for the X, Y, and Theta axes, and an adjustable electronic clutch for setting substrate-to-mask pressure. This system utilizes a pneumatic load/unload mask assembly, and is available with single or split-field optics. The Series 500 features a processor interface and integrated vibration isolation system. The system may be operated in manual or semiautomatic modes. The laboratory-grade console provides the operator with ample work and storage areas. Unexcelled in long term reliability, versatility and ease of use, the Model 500 Mask Alignment and Exposure System is a powerful tool that combines functionality and low cost of ownership. Click here for features and specifications Click here to return to product selection page |