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FEATURES
AND SPECIFICATIONS
• High efficiency,
uniform, exposure w/ iIntensity controlling power supply
• Submicron Printing and Level-to-Level
Alignments
• Easily Interchangeable Mask Holders and Chucks
• User-settable, "Substrate-to Mask" Pressure
• Non-Contact, Soft Contact and Soft-through-Hard Vacuum Contact
• Infrared Alignment Capability
• Numerous Alignment Optics Options
• Automated Sequences as well as Fully Manual operation
• System Vibration Isolation having 4-quadrant independent
adjustment
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