The OAI Model 800 Mask Aligner is a four-camera, manual, optical backside mask alignment system. It delivers ultra-precise (1µm-2µm) optical alignment accuracy and is designed to greatly surpass the performance of any IR backside aligner at an extremely competitive price.

In its basic configuration, the Model 800 provides full optical backside alignment and is ideal for use in low volume production, R&D labs, and universities. This mask aligner is available with additional automation options for increased throughput.

The Model 800 may be purchased as a topside aligner and upgraded to full optical backside alignment capability when required. The Model 800 can be configured with a wide variety of OAI light sources that range in power up to 2KW. The mask aligner tooling can accommodate substrates up to 8-inch square, and the wafer chuck is positioned to allow for easy loading and unloading.

Built on a vibration isolation platform, the fixed mask holder assembly guarantees alignment accuracy and repeatability. The operation is simplified using the easy-to-read, PLC touch-screen. Training time is short, an operator can learn to use the alignment tool effectively in less than one hour.

FEATURES AND SPECIFICATIONS
• Designed for semiconductor, MEMS front side and backside lithography and nanotechnology
• Excellent for sub-micron printing
• Precision level-to-level mask alignment
• Four-camera optical system for double sided alignment
• Interchangeable mask holders and chucks
• User-defined & controlled substrate-to-mask pressure
• Soft, hard and vacuum contact printing capability