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| The OAI Model
8000 is an advanced, high-performance backside mask aligner and exposure tool
that delivers ultra precise, front and back side, sub-micron alignment
and resolution for the most demanding bulk and surface MEMS applications.
The system is available as a manual or fully automated mask aligner, and is capable of performing sub-micron, level-to-level alignment and double sided lithography. It's flexible design allows printing on various substrates - round or square - up to 300mm. The exposure system is compatible with photoresist in Near, Mid or Deep UV range. This versatile mask aligner for double sided lithography is engineered for a wide variety of process applications. With it's proven, modularized design, it delivers the scalability required to accommodate changing process parameters. This automated mask aligner is designed primarily as a full production tool; the manual version is well adapted to low volume production, short-run engineering, or R&D applications. The tool may be used in proximity, contact or vacuum modes. Other notable features include auto pre-aligner, intensity controlling power supply system and ,dual zoom CCD TV exposure lamp power up to 5000W and a low-maintenance design. Click here for features and specifications Click here to return to product selection page |