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| Wafer
bonding has found many applications in the field of MST, MEMS or microengineering.
These include the fabrication of pressure sensors, accelerometers,
micropumps and other fluid handling devices. The process is also used
for first-order packaging of silicon microstructures to isolate package
induced stresses. A prominent feature of OAI's wafer bonder allows the alignment and bonding to be performed in-situ in a high vacuum chamber. For Anodic Bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are only aligned and brought into contact after the process temperature is reached, thus avoiding differential thermal expansion effects which can compromise alignment. These features therefore allow the Wafer Bonder to be used with any manufacturer's processing tool. Click here for features and specifications Click here to return to product selection page |