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| FEATURES
AND SPECIFICATIONS • System complete - no other equipment needed. • Built for purpose - NOT a modified mask aligner! • Low cost of ownership. • In-situ alignment for more reliable and accurate bonds. • Ease of use, high flexibility • Standard bonder and custom options to suit your needs. • Ability to see bond formation via in-situ optics. • Able to bond thin silicon wafers. • High thoughput Anodic bonding, using N2, cooling 30 min cycle times • Fast changeover of wafer platen sizes Click here to return to Wafer Bonder main page Click here to return to product selection page |