MEMS & Microfluidics

Mask Aligners

Model 200
Tabletop Contact Mask Aligner

Model 800E
Enhanced High Performance Front and Backside Mask Aligner

Model 6000
Fully Automated Optical Frontside or Backside Mask Aligner for Production

UV Light Sources & Exposure Systems

Model 30 Light Source
Collimated modular unit with excellent uniformity

Model 30 Enhanced UV Light Source
Collimated light source with added features

AML Wafer Bonders

AML Wafer Bonder
In-situ AML Wafer Bonder for anodic, silicon direct or compression bonding

Microfluidic Device Process

Contact Liquid Polymer Process
(CLiPP) Microfluidic prototype and production

UV Ozone Surface Treatment System

UV Ozone Surface Treatment System
For improved bonding and cleaning

Custom Solutions

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Semiconductor & Nanotechnology

Mask Aligners

PhableR-100
High resolution, non-contact, proximity photolithography

Model 200
Table top contact mask Aligner

UV Light Sources & Exposure Systems

Model 30 Enhanced UV Light Source
Collimated light source with added features

Model 2000AF
Automated Flood Exposure Systems

Model 2000SM
Automated Edge Bead Exposure Systems

Model 2012AF
300mm Automated Food Exposure Systems

Model 2012SM
300mm Automated Edge Bead Exposure Systems

Nanoimprint Technology (NIL)

Nano Imprint Module
Aligner add-on with high yield release technology

Custom Solutions

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oai model 200IR front and backside mask aligner

Model 200IR Front and Backside Mask Aligner

The OAI Model 200IR Mask Aligner is a bench top system that requires minimal clean room space. It is a cost-effective alternative for R&D or limited scale, pilot production. Utilizing an innovative, air bearing / vacuum chuck leveling system, the substrate is leveled quickly and gently, for parallel photo mask alignment and uniform contact across the wafer during contact exposure. The Model 200IR Mask Aligner is capable of one micron resolution and alignment precision. It has an alignment module which features mask insert sets and quick-change wafer chucks that enable the use of a variety of substrates and masks without requiring tools for reconfiguration. The alignment module incorporates micrometers for X, Y, and z-axis.

This mask Aligner features a dependable OAI light source that provides collimated UV light in Near or Deep UV using lamps ranging in power from 200 to 2000 watts. Dual-sensor, optical feedback loops are linked to the constant intensity controller to provide control of exposure intensity within ±2% of the desired intensity. Changes may be made to the UV wavelength quickly and easily. The Model 200IR Mask Aligner is a flexible, economic solution for any entry-level mask alignment and UV exposure application for MEMS, Microfluidics and NIL.