MEMS & Microfluidics

Mask Aligners

Model 200
Tabletop Contact Mask Aligner

Model 800FSA
Topside Mask Aligner

Model 800MBA
Semi-automated Topside and Optical Backside Mask Aligner

Model 6000
Fully Automated Optical Topside or Backside Mask Aligner for Production

UV Light Sources & Exposure Systems

Model 30 Light Source
Collimated modular unit with excellent uniformity

Model 30 Enhanced UV Light Source
Collimated light source with added features

AML Wafer Bonders

AML Wafer Bonder
In-situ AML Wafer Bonder for anodic, silicon direct or compression bonding

Microfluidic Device Process

Contact Liquid Polymer Process
(CLiPP) Microfluidic prototype and production

UV Ozone Surface Treatment System

UV Ozone Surface Treatment System
For improved bonding and cleaning

Custom Solutions

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Semiconductor & Nanotechnology

Mask Aligners

Model 800FSA
Topside Mask Aligner

Model 800MBA
Semi-automated Topside and Optical Backside Mask Aligner

PhableR-100
High resolution, non-contact, proximity photolithography

Model 200
Table top contact mask Aligner

UV Light Sources & Exposure Systems

Model 30 Enhanced UV Light Source
Collimated light source with added features

Model 2000AF
Automated Flood Exposure Systems

Model 2000SM
Automated Edge Bead Exposure Systems

Model 2012AF
300mm Automated Food Exposure Systems

Model 2012SM
300mm Automated Edge Bead Exposure Systems

Nanoimprint Technology (NIL)

Nano Imprint Module
Aligner add-on with high yield release technology

Custom Solutions

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OAI mask aligner - Model 200

Model 200 Mask Aligner

The OAI Model 200 Mask Aligner is a cost-effective high performance mask Aligner that has been engineered with industry proven components that have made OAI a leader in the photolithography capital equipment industry. The Model 200 is a bench top mask Aligner that requires minimal cleanroom space. It offers an economic alternative for R&D, or limited scale, pilot production. Utilizing an innovative, air bearing / vacuum chuck leveling system, the substrate is leveled quickly and gently, for parallel photo mask alignment and uniform contact across the wafer during contact exposure. The system is capable of one micron resolution and alignment precision.

The alignment module features mask insert sets and quick-change wafer chucks that facilitate the use of a variety of substrates and masks without requiring special tools for reconfiguration. The alignment module incorporates micrometers for X, Y, and Z-axis.

The Model 200 Mask Aligner features a dependable OAI UV light source which provides collimated UV light in Near or Deep UV using lamps ranging in power from 200 to 2000 watts. Dual-sensor, optical feedback loops are linked to the constant intensity controller to provide control of exposure intensity within ±2% of the desired intensity. Changes may be made to the UV wavelength quickly and easily. This mask Aligner is a flexible, economic solution for any entry-level mask alignment and UV exposure application.