MEMS & Microfluidics

Mask Aligners

PhableR-100
High resolution, non-contact, proximity photolithography

Model 200IR
Front side and IR backside mask aligner

Model 800FSA
Front side mask aligner

Model 800MBA
Semi-automated front side and optical backside mask aligner

Model 8000
Fully automated optical front side and backside mask aligner

Wafer Bonders

Wafer Bonder
In-situ wafer bonder for anodic, silicon direct or compression bonding

UV Light Sources & Exposure Systems

Model 30 UV Light Source
Collimated modular unit with excellent uniformity

Model 30 Enhanced UVLight Source
Collimated UV light source with added features

Maskless Laser Direct Write Lithography Systems

Dilase Model 250
Entry level, tabletop system is perfect for fast prototyping and maskless fabrication

Dilase Model 650
Fully featured, mid-range, maskless direct dual laser write lithography system

Dilase Model 750
High-end maskless Laser Direct Write Lithography System with up to 4 different wavelengths

Microfluidic Device Process

Contact Liquid Polymer Process
(CLiPP) Microfluidic prototype and production

UV Ozone Surface Treatment System

UV Ozone Surface Treatment System
For improved bonding and cleaning

MEMS Specialized Equipment

Hydrofluoric acid vapor phase etcher
Model VPE

Infrared light wafer inspection microscope
Model IRM

IR light wafer bonding inspection device
Model WBI

Chip-to-chip bonder
Model CCB

Wet process wafer chuck
Model WPWC

Electrostatic Chuck
Model ESC

Shadow Mask Aligner
Model SMA

Wafer chuck for uniform electro-deposition
Model WEDC

Custom Solutions

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Semiconductor & Nanotechnology

Mask Aligners

PhableR-100
High resolution, non-contact, proximity photolithography

Model 800FSA
Front side mask aligner

Model 800MBA
Semi-automated front-side and optical backside mask aligner

Model 5000
Automated contact proximity mask aligner

UV Light Sources & Exposure Systems

Model 30 UV Light Source
Collimated, modular unit with excellent uniformity

Model 30 Enhanced UV Light Source
Collimated UV light source with added features

Model 2000AF
Automated flood exposure systems

Model 2000SM
Automated edge bead exposure systems

Model 2012AF
300mm automated flood exposure systems

Model 2012SM
300mm automated edge bead exposure systems

Nanoimprint Technology (NIL)

Nano Imprint Module
Mask aligner add-on with high yield release technology

Custom Solutions

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OAI mask aligner - Model 200

Model 200 Mask Aligner

The OAI Model 200 Mask Aligner is a cost-effective high performance mask aligner that has been engineered with industry proven components that have made OAI a leader in the photolithography capital equipment industry. The Model 200 is a bench top mask aligner that requires minimal cleanroom space. It offers an economic alternative for R&D, or limited scale, pilot production. Utilizing an innovative, air bearing / vacuum chuck leveling system, the substrate is leveled quickly and gently, for parallel photo mask alignment and uniform contact across the wafer during contact exposure. The system is capable of one micron resolution and alignment precision.

The alignment module features mask insert sets and quick-change wafer chucks that facilitate the use of a variety of substrates and masks without requiring special tools for reconfiguration. The alignment module incorporates micrometers for X, Y, and Z-axis.

The Model 200 Mask Aligner features a dependable OAI UV light source which provides collimated UV light in Near or Deep UV using lamps ranging in power from 200 to 2000 watts. Dual-sensor, optical feedback loops are linked to the constant intensity controller to provide control of exposure intensity within ±2% of the desired intensity. Changes may be made to the UV wavelength quickly and easily. This mask aligner is a flexible, economic solution for any entry-level mask alignment and UV exposure application.