Semiconductor & Nanotechnology

Mask Aligners

PhableR-100
High resolution, non-contact, proximity photolithography

Model 200
Table top contact mask Aligner

Model 800E
Enhanced High Performance Front and Backside Mask Aligner

UV Light Sources & Exposure Systems

Model 30 UV Light Source
Collimated, modular unit with excellent uniformity

Model 30 Enhanced UV Light Source
Collimated light source with added features

Model 2000AF
Automated flood exposure systems

Model 2000SM
Automated edge bead exposure systems

Model 2012SM
300mm automated edge bead exposure systems

Nanoimprint Technology (NIL)

Nano Imprint Module
Aligner add-on with high yield release technology

Custom Solutions

Partner with OAI to solve your unique requirements
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Large Area Exposure Systems

Mask Aligners

PhableR-100
High resolution, non-contact, proximity photolithography

Model 5000E
Mask Aligner for large area substrates and display

UV Light Sources & Exposure Systems

UV Light Source Grande
Accommodates a full range of large substrates

Custom Solutions

Partner with OAI to solve your unique requirements

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oai model 2012 edge-bead exposure system

300mm Automated Flood Exposure System
Model 2012AF

The Model 2012AF Flood Exposure System provides a cost-effective method for automated flood exposure. Designed to accommodate wafers from 8” to 300mm, the tool features automated FOUP loading. Mask and substrate changeover can be accomplished quickly and easily adding to both versatility and high-volume throughput of this production tool.