MEMS & Microfluidics

Mask Aligners

Model 200
Tabletop contact mask aligner

Model 200IR
Front side and IR backside mask aligner

Model 800FSA
Front side aligner

Model 800MBA
Semi-automated front side and optical backside mask aligner

Model 8000
Fully automated optical front side and backside mask aligner

Wafer Bonders

Wafer Bonder
In-situ wafer bonder for anodic, silicon direct or compression bonding

UV Light & Exposure Systems

Model 30 Light Source
Collimated modular unit with excellent uniformity

Microfluidic Device Process

Contact Liquid Polymer Process
(CLiPP) Microfluidic prototype and production

UV Ozone Surface Treatment System

UV Ozone Surface Treatment System
For improved bonding and cleaning

MEMS Specialized Equipment

Model VPE
Hydrofluoric acid vapor phase etcher

Model IRM
Infrared light wafer inspection microscope

Model WBI
IR light wafer bonding inspection device

Model CCB
Chip-to-chip bonder

Model WPWC
Wet process wafer chuck

Model WEDC
Wafer chuck for uniform electro-deposition

Custom Solutions

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Semiconductor & Nanotechnology

Mask Aligners

Model 200
Table top contact mask aligner

Model 800FSA
Front side aligner

Model 800MBA
Semi-automated front-side and optical backside mask aligner

Model 5000
Automated contact proximity mask aligner

UV Light & Exposure Systems

Model 30 Light Source
Collimated, modular unit with excellent uniformity

Model 2000AF
Automated flood exposure systems

Model 2000SM
Automated edge bead exposure systems

Model 2012AF
300mm automated flood exposure systems

Model 2012SM
300mm automated edge bead exposure systems

Nanoimprint Technology (NIL)

Nano Imprint Module
Aligner add-on with high yield release technology

Custom Solutions

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Model 30E Enhanced Light Source

The OAI UV Model 30E Enhanced Light Source consists of a stand-alone Model 30 UV Light Source, a constant intensity controller, and a shutter timer, and a pull out drawer with a rotating chuck. Rotating the chuck during flood exposure improves exposure uniformity.