Semiconductor & Nanotechnology

Mask Aligners

Model 200
Table top contact mask Aligner

Model 800E
Enhanced High Performance Front and Backside Mask Aligner

UV Light Sources & Exposure Systems

Model 30 UV Light Source
Collimated, modular unit with excellent uniformity

Model 30 Enhanced UV Light Source
Collimated light source with added features

Model 2000AF
Automated flood exposure systems

Model 2000SM
Automated edge bead exposure systems

Model 2012AF
300mm automated flood exposure systems

Model 2012SM
300mm automated edge bead exposure systems

Nanoimprint Technology (NIL)

Nano Imprint Module
Aligner add-on with high yield release technology

Custom Solutions

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Model 6000 Mask Aligner

Model 6000 Fully Automated, Frontside or Backside Mask Aligner for Production

For: Semiconductors, MEMS, Sensors, Microfluidics, IOT, Packaging

With over 4 decades of manufacturing in the semiconductor industry, OAI meets the growing challenge of a dynamic market with a new elite class of production photolithography equipment.

Built on the venerable OAI modular platform, the Series 6000 has frontside or backside alignment that is fully automated with sub-micron resolution which delivers performance that is unmatched at any price.

The Aligners have Advanced Beam Optics with better than ±3% uniformity and a throughput of 180 wafers per hour in first mask mode, which results in higher yields. The Series 6000 can handle a wide variety of wafers from thick and bonded substrates (up to 7000 microns), warped wafers (up to 7 mm-10mm), thin substrates (down to 100 micron thick), and thick photo resist.

With superb process repeatability, the Series 6000 is the perfect solution for all production enviroments. Choose either frontside or optional back side alignment which uses OAI's customized pattern recognition software that is Cognex based. For the total lithography process, the Seriesl 6000 can be integrated seamlessly with cluster tools. OAI's new production mask Aligners are the total package.

BENEFITS

SPECIFICATIONS

Exposure System
Exposure Modes Vacuum contact Hard contact Soft contact Proximity (2μ gap)
Advanced Beam Optics
Uniform Beam Size: 50mm - 200mm square/round
  200mm - 300 mm square/round
Uniformity: Better than ±3%
Camera: Dual Camera with CCTV with Expanded Depth of Field
Alignment System
Pattern Recognition Cognex visionPro¹™ with OAI customized software
Alignment Accuracy 0.5μ topside
  1.0μ with top to bottom optional backside alignment
Pre-alignment Accuracy Better than ±50μ
Auto-alignment Top to bottomside
  Topside
Wafer Handling
Substrate size 50mm – 200mm round or square or 200mm-300mm round or square
Thin wafers Down to 100Μ
Warped Wafers Up to 7mm-10mm
Thick & Bonded Substrates Up to 7000μ
Robotics Single and dual arm wafer handling
Run-out compensation Standard software or optional thermal chuck
Wafer size conversion 5 minutes or less
Throughput 1st mask 180 wafers per hour - subsequent 75-100 wafers per hour
Wedge Effect Leveling 3 point or optional non-contact
Available Options
  IR Auto-align,
  Cassette Mapping
  365nm LED Exposure Light Source
  Temperature Controlled Wafer Chuck
  Integrated Mask Management Control
  Integrated Lithography Cluster for Full Lithography
  Process Environment Control with SMIF or FOUP Interface Modules
  Non-contact Leveling
  Edge Gripping