MEMS & Microfluidics

Mask Aligners

Model 200
Tabletop contact mask aligner

Model 200IR
Front side and IR backside mask aligner

Model 800FSA
Front side aligner

Model 800MBA
Semi-automated front side and optical backside mask aligner

Wafer Bonders

Wafer Bonder
In-situ wafer bonder for anodic, silicon direct or compression bonding

UV Light & Exposure Systems

Model 30 Light Source
Collimated modular unit with excellent uniformity

Model 30 Enhanced Light Source
Collimated light source with added features

Microfluidic Device Process

Contact Liquid Polymer Process
(CLiPP) Microfluidic prototype and production

UV Ozone Surface Treatment System

UV Ozone Surface Treatment System
For improved bonding and cleaning

MEMS Specialized Equipment

Model VPE
Hydrofluoric acid vapor phase etcher

Model IRM
Infrared light wafer inspection microscope

Model WBI
IR light wafer bonding inspection device

Model CCB
Chip-to-chip bonder

Model WPWC
Wet process wafer chuck

Model WEDC
Wafer chuck for uniform electro-deposition

Custom Solutions

Partner with OAI to solve your unique requirements
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Model 8000 Data Sheet

Download

oai model 8000 data image

Specs and options available when you download the PDF

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oai model 8000 front-side and back-side automated mask aligner

Model 8000 Automated Front-side and Backside Mask Aligner System

The OAI Model 8000 Mask Aligner is an advanced, high-performance optical front and backside mask aligner and exposure tool that delivers ultra precise, front and back side, sub-micron alignment and resolution for the most demanding bulk and surface MEMS applications.

Model 8000 is capable of performing level-to-level alignment and double-sided lithography. The flexible design allows printing on various substrates (round or square) up to 300mm. The exposure system is compatible with photo resist in Near, Mid or Deep UV range.

This versatile mask aligner system is designed for double-sided lithography and is engineered for a wide variety of process applications. With its proven, modular design, it delivers the scalability required to accommodate changing process parameters. This automated mask aligner system is designed primarily as a full production tool, but is available in a manual configuration for which it is well suited for low volume production, short-run engineering, or R&D applications. The tool may be used in proximity, contact or vacuum modes. Other notable features include auto pre-aligner, intensity controlling power supply system and, dual zoom CCD TV exposure lamp power up to 5000W and a low-maintenance design.