MEMS & Microfluidics

Mask Aligners

Model 200
Tabletop contact mask aligner

Model 200IR
Front side and IR backside mask aligner

Model 800FSA
Front side aligner

Model 8000
Fully automated optical front side and backside mask aligner

Wafer Bonders

Wafer Bonder
In-situ wafer bonder for anodic, silicon direct or compression bonding

UV Light & Exposure Systems

Model 30 Light Source
Collimated modular unit with excellent uniformity

Model 30 Enhanced Light Source
Collimated light source with added features

Microfluidic Device Process

Contact Liquid Polymer Process
(CLiPP) Microfluidic prototype and production

UV Ozone Surface Treatment System

UV Ozone Surface Treatment System
For improved bonding and cleaning

MEMS Specialized Equipment

Model VPE
Hydrofluoric acid vapor phase etcher

Model IRM
Infrared light wafer inspection microscope

Model WBI
IR light wafer bonding inspection device

Model CCB
Chip-to-chip bonder

Model WPWC
Wet process wafer chuck

Model WEDC
Wafer chuck for uniform electro-deposition

Custom Solutions

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Semiconductor & Nanotechnology

Mask Aligners

Model 200
Table top contact mask aligner

Model 800FSA
Front side aligner

Model 5000
Automated contact proximity mask aligner

UV Light & Exposure Systems

Model 30 Light Source
Collimated, modular unit with excellent uniformity

Model 30 Enhanced Light Source
Collimated light source with added features

Model 2000AF
Automated flood exposure systems

Model 2000SM
Automated edge bead exposure systems

Model 2012AF
300mm automated flood exposure systems

Model 2012SM
300mm automated edge bead exposure systems

Nanoimprint Technology (NIL)

Nano Imprint Module
Aligner add-on with high yield release technology

Custom Solutions

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NIL Nanoimprint Module

oai NIL nanoimprint lithography image

The OAI Nanoimprint Module System is a modular add-on that may be used on any mask aligner.

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oai-800mba mask aligner

Model 800MBA Optical Front and Backside Mask Aligner System

The OAI Model 800MBA Mask Aligner is a semi-automated, four-camera, optical front and backside mask aligner. It delivers ultra-precise (1µm-2µm) alignment accuracy and is designed to greatly surpass the performance of any IR backside aligner at an extremely competitive price. The versatile Model 800MBA mask aligner is ideal for use in low volume production, R&D labs, and universities.

The Model 800MBA Mask Aligner can be configured with a wide variety of OAI light sources that range in power up to 2KW. The mask aligner tooling can accommodate substrates up to 8-inch square, and the wafer chuck is positioned to allow for easy loading and unloading. This cost-effective mask aligner also features motorized backside focus, motorized auto leveling and auto gap setting.

Built on a vibration isolation platform, the fixed mask holder assembly guarantees alignment accuracy and repeatability. Operation is simplified using the easy-to-read, PLC touch-screen. Training time is short; an operator can learn to use the mask aligner effectively in less than one hour.