Model CCB
Chip-to-Chip Bonder
Precise alignment and bonding of two single chips is very often needed for building three-dimensional structures or packaging in MEMS fabrication. With the chip-to-chip bonder it becomes possible to align two chips manually. The chips can then be brought into contact in order to perform anodic bonding or various gluing processes. The single chip alignment stage includes three linear axis and three-rotation axis, which provides enough degrees of freedom for most alignment applications.
The lower chip is clamped on a base plate, and a needle holds the upper chip. Both vacuum holders can be adjusted and switched separately. In order to perform the anodic bonding process a heating plate and high voltage source are provided. The bond-voltage is adjusted on a controller unit, which monitors the voltage and the bond-current. The temperature of the heating plate is as well adjusted on the controller unit. The device is designed for research institutions and can be adapted for your special applications.
- 3 linear axis
- 3 rotation axis
- Heating plate up to 500°C
- High voltage source for anodic bonding
- Chip alignment under microscope
- Safe operation