MEMS & Microfluidics

Mask Aligners

Model 200
Tabletop contact mask aligner

Model 200IR
Front side and IR backside mask aligner

Model 800FSA
Front side aligner

Model 800MBA
Semi-automated front side and optical backside mask aligner

Model 8000
Fully automated optical front side and backside mask aligner

Wafer Bonders

Wafer Bonder
In-situ wafer bonder for anodic, silicon direct or compression bonding

UV Light & Exposure Systems

Model 30 Light Source
Collimated modular unit with excellent uniformity

Model 30 Enhanced Light Source
Collimated light source with added features

UV Ozone Surface Treatment System

UV Ozone Surface Treatment System
For improved bonding and cleaning

MEMS Specialized Equipment

Model VPE
Hydrofluoric acid vapor phase etcher

Model IRM
Infrared light wafer inspection microscope

Model WBI
IR light wafer bonding inspection device

Model CCB
Chip-to-chip bonder

Model WPWC
Wet process wafer chuck

Model WEDC
Wafer chuck for uniform electro-deposition

Custom Solutions

Partner with OAI to solve your unique requirements
>> Return to top

banner-image

oai CLiPPContact Liquid Polymer Process (CLiPP) for Microfluidic Devices

CLiPP Contac Liquid Polymer Process is a fabrication process designed for the prototyping and manufacture of microfluidic devices. Perfect for single or multi-dimensional structures, the process is used with readily available liquid UV polymers. The process is suitable for creating hydrophobic or hydrophilic surfaces and channels. For a complete solution, the Contac Liquid Polymer Process (CliPP) modules can be mounted on any OAI mask aligner system for manufacturing microfluidic devices.