Dilase Model 650
Maskless Direct
Laser Write
Lithography System
The Dilase Model 650 is a fully featured, mid-range, maskless direct laser write lithography system. This system is a high-performance dual laser processing tool that is dedicated to maskless photolithography. This new technology is designed to shorten the prototyping and development time required when introducing new products. Powered by very fast and accurate stages, Dilase Model 650 facilitates writing complex patterns in photosensitive resins deposited on planar substrates measuring up to 6 inches diameter. The laser writing is achieved by means of one of the continuos laser sources (375nm or 405nm). Up to 2 different optical tubes can be implemented on the Dilase 650. This feature provides the opportunity to use up to two different spot sizes and hence, to combine a high resolution head to achieve micron-scaled patterns, while simultaneously using the wider sized spot to optimize writing times on large surfaces.
Unlike other direct laser write systems, only Dilase systems feature both vector and raster writing modes, and ensures writing trajectory within <100nm deviation range. The Dynamic Writing Mode uses vector processing which is essential for achieving curves and circles with smooth features. Raster mode enables inscription of unspecified patterns using a raster scaning technique. 3D exposure is possible with up to 5,000 levels of gray scale - far exceeding any similar systems now available.
Dilase Model 650 is fully compatible with most commercially available photoresists, including, but not limited to SU8, Shipley and AZ resins. The system is, however, optimized for use with special K-CL resins to achieve fine resolution and high form factor microfluidic devices fabrication. K-CL and other high performance photoresists, coatings and UV bonding materials are available from OAI.
APPLICATIONS
- Integrated optical circuits
- Microstructures
- Mask lithography
- Diffractive gratings
- Microlense arrays
- Pixelated objects
- Optical wave guides
- BioMEMS
- Optical gratings (blased & unblased)
SPECIFICATIONS
Stage travel resolution 100nm
Repeatability 100nm
Absolute positioning precision 1μn
Orthogonality < 1mRad
Laser wavelength 375nm or 405nm
Laser spot size 1μ to 100μm
Substrate size (diameter) up to 6 inches
Substrate thickness 250μm to 12mm
Maximum linear writing speed >500mm.s-1
Writing modes Vector & raster
Compatible file formats LWI - GDSII - DXF
Size (LxWxH) 925 x 925 x 575mm
Operating temperature <30°C (stable ± 1°C)
Power supply 110V or 220V AC
Laser security class 3b
Vacuum supply Required
FEATURES
- Super high aspect ratio lithography better than (10:1)
- 5,000-level, 3D exposure
- Dual writing modes - vector & raster
- Deep depth of focus - large exposure area