MEMS & Microfluidics

Mask Aligners

PhableR-100
High resolution, non-contact, proximity photolithography

Model 200IR
Front side and IR backside mask aligner

Model 800FSA
Front side mask aligner

Model 800MBA
Semi-automated front side and optical backside mask aligner

Model 8000
Fully automated optical front side and backside mask aligner

Wafer Bonders

Wafer Bonder
In-situ wafer bonder for anodic, silicon direct or compression bonding

UV Light Sources & Exposure Systems

Model 30 UV Light Source
Collimated modular unit with excellent uniformity

Model 30 Enhanced UVLight Source
Collimated UV light source with added features

Maskless Laser Direct Write Lithography Systems

Dilase Model 250
Entry level, tabletop system is perfect for fast prototyping and maskless fabrication

Dilase Model 750
High-end maskless Laser Direct Write Lithography System with up to 4 different wavelengths

Microfluidic Device Process

Contact Liquid Polymer Process
(CLiPP) Microfluidic prototype and production

UV Ozone Surface Treatment System

UV Ozone Surface Treatment System
For improved bonding and cleaning

MEMS Specialized Equipment

Hydrofluoric acid vapor phase etcher
Model VPE

Infrared light wafer inspection microscope
Model IRM

IR light wafer bonding inspection device
Model WBI

Chip-to-chip bonder
Model CCB

Wet process wafer chuck
Model WPWC

Electrostatic Chuck
Model ESC

Shadow Mask Aligner
Model SMA

Wafer chuck for uniform electro-deposition
Model WEDC

Custom Solutions

Partner with OAI to solve your unique requirements
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Semiconductor & Nanotechnology

Mask Aligners

PhableR-100
High resolution, non-contact, proximity photolithography

Model 200
Table top contact mask aligner

Model 200IR
Front side and IR backside mask aligner

Model 800FSA
Front side mask aligner

Model 800MBA
Semi-automated front-side and optical backside mask aligner

Model 5000
Automated contact proximity mask aligner

UV Light Sources & Exposure Systems

Model 30 UV Light Source
Collimated, modular unit with excellent uniformity

Model 30 Enhanced UV Light Source
Collimated UV light source with added features

Model 2000AF
Automated flood exposure systems

Model 2000SM
Automated edge bead exposure systems

Model 2012AF
300mm automated flood exposure systems

Model 2012SM
300mm automated edge bead exposure systems

Nanoimprint Technology (NIL)

Nano Imprint Module
Mask aligner add-on with high yield release technology

Custom Solutions

Partner with OAI to solve your unique requirements
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You might also be interested in our other NEW maskless Laser Direct Write lithography systems

Model 250 our entry level system featuring a tabletop footprint with absolute positioning precision of 3μm and a substrate size of 1 to 4 inches.

Model 750 a fully customizable maskless Laser Direct Write lithography system with absolute positioning of 1μm and a substrate size of 1 to 12 inches.

 

 

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oai dilase 650 maskless direct write lithography system

Dilase Model 650
Maskless Laser Direct Write
Lithography System

The Dilase Model 650 is a fully featured, mid-range, maskless Laser Direct Write lithography system. This system is a high-performance dual laser processing tool that is dedicated to maskless photolithography. This new technology is designed to shorten the prototyping and development time required when introducing new products. Powered by very fast and accurate stages, Dilase Model 650 facilitates writing complex patterns in photosensitive resins deposited on planar substrates measuring up to 6 inches diameter. The laser writing is achieved by means of one of the continuos laser sources (375nm or 405nm). Up to 2 different optical tubes can be implemented on the Dilase 650. This feature provides the opportunity to use up to two different spot sizes and hence, to combine a high resolution head to achieve micron-scaled patterns, while simultaneously using the wider sized spot to optimize writing times on large surfaces.

Unlike other Laser Direct Write systems, only Dilase systems feature both vector and raster writing modes, and ensures writing trajectory within <100nm deviation range. The Dynamic Writing Mode uses vector processing which is essential for achieving curves and circles with smooth features. Raster mode enables inscription of unspecified patterns using a raster scaning technique. 3D exposure is possible with up to 5,000 levels of gray scale - far exceeding any similar systems now available.

Dilase Model 650 is fully compatible with most commercially available photoresists, including, but not limited to SU8, Shipley and AZ resins. The system is, however, optimized for use with special K-CL resins to achieve fine resolution and high form factor microfluidic devices fabrication. K-CL and other high performance photoresists, coatings and UV bonding materials are available from OAI.

APPLICATIONS

SPECIFICATIONS

Stage travel resolution 100nm
Repeatability 100nm
Absolute positioning precision 1μn
Orthogonality < 1mRad
Laser wavelength 375nm or 405nm
Laser spot size 1μ to 100μm
Substrate size (diameter) up to 6 inches
Substrate thickness 250μm to 12mm
Maximum linear writing speed >500mm.s-1
Writing modes Vector & raster
Compatible file formats LWI - GDSII - DXF
Size (LxWxH) 925 x 925 x 575mm
Operating temperature <30°C (stable ± 1°C)
Power supply 110V or 220V AC
Laser security class 3b
Vacuum supply Required

FEATURES