Model VPE
Hydrofluoric Acid Vapor Phase Etcher
OAI offers a hydro-fluoric acid vapor phase etching (HF VPE) apparatus for sticking free silicon dioxide etching in micro-fabrication. Thinner gaps and fragile structures make the release of micro-electromechanical systems a difficult task. The cohesion forces of liquid HF acid destroys the tiny structures or makes them stick permanently. Etching in a HF acid vapor atmosphere is a quasi-dry process. By heating the substrate, the amount of water on the wafer can be controlled. Since the wafer is never in contact with any liquid, sticking free MEMS release can be performed. Typical etch rates are in the order of 4-10 m/hour.
The vapor phase etcher is available as 4”, 6” and 8” version.
- Safe acid handling
- Re-usable HF acid
- Easy wafer clamping mechanism
- Ideal for all wafer sizes
- No installation required (apparatus is used in an acid wet bench)
- Upside down etching of wafers
- Back-side protection
- Low running costs