Model WBI
IR Light Wafer Bonding Inspection Device
Silicon is transparent for infrared light. Our IR light wafer bonding inspection device (WBI) illuminates the silicon substrate from the back-side and captures the light that permeates the substrate. Therefore, it becomes possible to inspect phenomena between two silicon substrates, which are not visible from the outside.
The inspection device is equipped with an infrared light source and a collimator optic that illuminates the wafer with a light beam having a uniform intensity. An IR sensitive camera displays the image of the inspected substrate on your computer through an USB connector. The field of view and magnification of the camera can be adjusted manually.
Devices are available for 100 mm, 150 mm and 200 mm wafers. Smaller wafer can be visualized with adapter rings. The 200mm version is equipped with a motorized wafer holder, which allows inspection of the complete wafer at higher magnifications. For the visualization of the wafers a personal computer with USB port and Windows 2000 or higher is required.
- Inspection before and after fusion bonding
- Alignment of silicon wafers/chips
- Quality control
- Inspection of large, released MEMS devices
- Measurement of the etching speed of buried materials (e.g. SOI wafers)