MEMS & Microfluidics

Mask Aligners

Model 200
Tabletop contact mask Aligner

Model 200IR
Front and IR backside mask Aligner

Model 800E
Enhanced High Performance Front and Backside Mask Aligner

Model 6000
Fully Automated Optical Frontside or Backside Mask Aligner for Production

UV Light Sources & Exposure Systems

Model 30 UV Light Source
Collimated modular unit with excellent uniformity

Model 30 Enhanced UV Light Source
Collimated light source with added features

Microfluidic Device Process

Contact Liquid Polymer Process
(CLiPP) Microfluidic prototype and production

UV Ozone Surface Treatment System

UV Ozone Surface Treatment System
For improved bonding and cleaning

Custom Solutions

Partner with OAI to solve your unique requirements
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oai AML Wafer Bonder

AML Wafer Bonder

Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses.

The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.