Model WEDC
Wafer Chuck for Uniform Electro-deposition
The electric contact to the wafer has a big influence on the deposition uniformity of your galvanically deposited metal. Our wafer chucks for electro-deposition have a ring-electrode to ensure the best possible electrical contact to your wafer. The back-side of the wafer is not in contact with the electrolyte and therefore protected from any contamination from the bath. Chucks for any wafer size as well as single chip chucks can be fabricated.
The chuck consists of a wafer holder and a clamping ring with an integrated ring electrode. The wafer is placed on the holder and fixed by the clamping ring, which is screwed to the chuck. The clamping ring facilitates the electrical connection to the wafer. Three precision sealing rings ensure a leak-proof clamping of the wafer. A user-defined recess in the holder minimizes the stress on the clamped wafer. The chucks are fabricated from PEEK, which are resistant to most of the electrolytes used in microfabrication. The connection to your electrical source is made by 150 cm long cable with a BNC or user defined connector. Every application is different. We are pleased to design your custom chuck to improve your results.