MEMS & Microfluidics

Mask Aligners

Model 200
Tabletop contact mask aligner

Model 200IR
Front side and IR backside mask aligner

Model 800FSA
Front side aligner

Model 800MBA
Semi-automated front side and optical backside mask aligner

Model 8000
Fully automated optical front side and backside mask aligner

Wafer Bonders

Wafer Bonder
In-situ wafer bonder for anodic, silicon direct or compression bonding

UV Light & Exposure Systems

Model 30 Light Source
Collimated modular unit with excellent uniformity

Model 30 Enhanced Light Source
Collimated light source with added features

Microfluidic Device Process

Contact Liquid Polymer Process
(CLiPP) Microfluidic prototype and production

UV Ozone Surface Treatment System

UV Ozone Surface Treatment System
For improved bonding and cleaning

MEMS Specialized Equipment

Model VPE
Hydrofluoric acid vapor phase etcher

Model IRM
Infrared light wafer inspection microscope

Model WBI
IR light wafer bonding inspection device

Model CCB
Chip-to-chip bonder

Model WEDC
Wafer chuck for uniform electro-deposition

Custom Solutions

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oai wet processing wafer chuck

Model WPWC

Wet Processing Wafer Chuck & Chuck Carriers

Etching wafers in liquid etching material involves that the whole wafer is in contact with the material. Our wet processing wafer chucks protect the back side of the wafer from being attacked. In this way deep structures can be etched without need to mask the back side. Chucks for any wafer size can be fabricated; single chip chucks are available as well.

The chuck consists of a wafer holder and a clamping ring. The wafer is placed on the holder and fixed by the clamping ring, which is screwed to the chuck. Three precision sealing rings ensure a leak-proof clamping of the wafer. A user-defined recess in the holder minimizes the stress on the clamped wafer.

The chucks are fabricated from PEEK, which is resistant to most of the etching solutions used in microfabrication (HF, KOH, TMAH). For the fabrication of thin membranes a ventilation tube, connecting the enclosed air in the chuck to the atmospheric pressure, can be added. This is highly recommended if the etching solution is heated. Every application is different. We are pleased to design your custom chuck to improve your results.