Wafer bonding has found many applications in the field of MST, MEMS and Micro engineering. Applications include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures in order to isolate package-induced stresses. OAI offers a wafer bonder that is excellent for anodic bonding, silicon direct, and thermo compression bonding applications. The stand-alone wafer bonders can used with any photolithography processing tool.
Wafer Bonder
In-situ wafer bonder for anodic, silicon direct or thermo compression bonding